Modulares Konzept für die SiC-Puck-Produktion

Your SiC boules. Our modular concept.

Our modular grinding concept intelligently separates face grinding and outer diameter grinding. Instead of rigid all-in-one systems, we minimize the risk of downtime and guarantee maximum uptime and flexibility in your production.

Our Modular Grinding Concept Compared to All-in-One Systems

Dividing SiC boule processing into specialized stand-alone machines eliminates the single point of failure found in complex integrated systems. Maintenance at one station does not cause the entire line to shut down, which maximizes overall uptime. In addition, decoupling the processes allows for flexible and rapid mechanical adaptation to changes in ingot diameter.

Maximized Overall System Availability Through a Modular Design
Maximum Uptime
Faster setup and grid alignment without angled clamping
Minimized setup time
Quick and flexible adjustment to boule diameter
Future-proof

GH SEED DOME GRINDER: Flat Surface Grinding

This system is designed for the precise grinding of the boule’s flat surfaces parallel to the crystal lattice structure. Thanks to control-based compensation, the need for mechanically angled clamping of the workpiece is completely eliminated. This minimizes setup times, eliminates manual adjustment errors, and ensures reproducible geometric accuracy of the orientation surface.

Präzise Bearbeitung eines SiC-Boules
Spannvorrichtung zur OD- und Notch-Bearbeitung

GH OD NOTCH GRINDER: Outer Diameter and Reference Grinding

The machine performs precise cylindrical grinding of the outer diameter (OD). Based on external measurement data, the CNC controller receives the exact position of the crystal orientation. Depending on the specifications, either a notch or a flat surface is automatically created to generate the exact reference mark for the subsequent slicing and wafering processes.

Intelligent CNC Control Software

Both the GH SEED DOME GRINDER and the GH OD NOTCH GRINDER operate on our future-proof, unified CNC platform. The proprietary G+H software is specifically optimized for SiC machining workflows: It enables the fully automated conversion of external workpiece measurement data directly into precise process parameters.

No complex G-code programming is required for manual adjustments—inputs are made quickly, reliably, and intuitively via a dialog-driven user interface.

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Unternehmensgebäude der Geibel & Hotz GmbH