RS 1000 CU CNC
Would you like to learn more about the mechanical performance specifications, dimensions, and axle configurations? You can find technical details on the official product page.
- Force-controlled clamping reliably prevents microcracks and structural damage in the brittle crystal lattice.
- Maximum protection of materials
- Quick changeovers and seamless adaptation to different ingot lengths make your production process extremely versatile.
- Future-Proof Flexibility
RS 1000 CU CNC: Maximum Precision for Long Semiconductor Crystals
This manufacturing system is designed for high-precision cylindrical grinding of the outer diameter (OD) of single-crystal ingots. The machine features a hydraulic tailstock with continuously adjustable clamping force, enabling highly sensitive, force-controlled clamping. This ensures that the extremely brittle ingot is clamped precisely with the force required for the grinding process, while preventing mechanical overload and chipping.
Intelligent Process Control for Seamless Operations
The dialog-driven, intuitive user interface allows the operator to control complex grinding cycles without any knowledge of G-code. Optionally, the system can be equipped with customized automation solutions (such as robotic loading) to maximize throughput during three-shift operation.
Detailed Machine Specifications
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Are you interested in our cylindrical grinders, or do you need a customized solution for your specific semiconductor materials? Please feel free to contact us, and our sales team will get back to you shortly.
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Geibel & Hotz GmbH
